Soracom Air IoT SIM Datasheet

General Specifications

SORACOM Air
SIM Card
SORACOM Air
Embedded SIM
Plan plan01s plan01s - LDV plan-NA1 plan-US plan01s plan01s - LDV plan-US
Product Image

Product Code SG001 SG002 SU001 SGEIL01 SGECL01 SUEIL01
Form Factor 3-in-1 (2FF/3FF/4FF) 3-in-1 (2FF/3FF/4FF) ecoSIM MFF2 (Industrial Grade) MFF2 (Commercial Grade) MFF2 (Industrial Grade)
Application USIM/SIM USIM/SIM
Hardware Temperature Range -25°C to +85°C (operation/storage) -40°C to +105°C (operation/storage) -25°C to +85°C (operation/storage) -40°C to +105°C (operation/storage)
Supply Voltage 1.62V to 3.3V (Class B/C) 1.62V to 5.5V (Class A/B/C) 1.62V to 3.3V (Class B/C) 1.62V to 5.5V (Class A/B/C)
Non-Volatile Memory 128 kilobytes NVM available NVM Endurance: Up to 500,000 Cycles/page @ 105°C NVM Endurance: Up to 100,000 Cycles/page @ 85°C NVM Endurance: Up to 500,000 Cycles/page @ 105°C
Data Retention Up to 10 years at 85°C Up to 15 years at 85°C Up to 15 years at 85°C, 10 years at 105°C Up to 10 years at 85°C Up to 15 years at 85°C, 10 years at 105°C
Other
  • M2M qualification (ETSI 102.671): NA
  • RoHS compliance
  • ESD Protection > 4kv
  • Ruggedized Form Factor MFF2: TB-MA-HA-CA-VA-SA-RA-UB
  • RoHS compliance
  • ESD Protection > 4kv
  • Ruggedized Form Factor MFF2: TS-MA-HA-CA-VA-SA-RA-UB
  • RoHS compliance
  • ESD Protection > 4kv
  • Ruggedized Form Factor MFF2: TB-MA-HA-CC-VA-SA-RC-UC
  • RoHS compliance
Software Java Card™ 3.0.4 3.0.2 3.0.1 3.0.2 3.0.2 3.0.1
Java Card™ Cryptographic APIs
  • CRC16, CRC32
  • DES, 3DES
  • AES 128/256 bits
  • CRC16, CRC32
  • DES, 3DES
  • AES 128/256 bits
  • CRC32
  • DES, 3DES
  • AES 128/256 bits
  • CRC16, CRC32
  • DES, 3DES
  • AES 128/256 bits
OTA
  • OTA over SMS (SCP80)
  • OTA over HTTPs: Global Platform 2.2 amendment B (SCP81)
  • OTA over SMS (SCP80)
  • OTA over HTTPs: Global Platform 2.2 amendment B (SCP81)
Other
  • 3GPP Release 11
  • SORACOM Subscription Container SIM applet
  • SORACOM Local Information SIM applet
  • 3GPP Release 14
  • SORACOM Subscription Container SIM applet
  • SORACOM Local Information SIM applet
  • 3GPP Release 11
  • SORACOM Subscription Container SIM applet
  • SORACOM Local Information SIM applet
  • 3GPP Release 12
  • SORACOM Subscription Container SIM applet
  • SORACOM Local Information SIM applet
  • 3GPP Release 14
  • SORACOM Subscription Container SIM applet
  • SORACOM Local Information SIM applet

Embedded SIM Specifications

The SORACOM Air Embedded SIM (eSIM) is available in a MFF2 package which is compliant with ETSI TS 102.671 specifications.

Physical Package

Embedded SIM mechanical drawing

Embedded SIM SGEIL01 (Industrial Grade)
D E D1 E1 A A1 A2 e L b
6.00±0.15 5.00±0.15 3.40±0.10 4.00±0.10 0.60±0.05 0.00–0.05 0.203 1.27 0.60±0.15 0.40±0.10
Embedded SIM SGECL01 (Commercial Grade)
D E D1 E1 A A1 A2 e L b
6.00±0.10 5.00±0.10 3.40±0.10 4.00±0.10 0.75±0.05 0.00–0.05 0.203 1.27 0.60±0.05 0.40±0.05
Embedded SIM SUEIL01 (Industrial Grade)
D E D1 E1 A A1 A2 e L b
6.00±0.15 5.00±0.15 3.40±0.10 4.00±0.10 0.75±0.05 0.00–0.05 0.203 1.27 0.60±0.15 0.40±0.10

Pin Layout

All Soracom Embedded SIM products follow pin assignment for contact points C1 to C8 as defined in ETSI TS 102.221 and TS 102.671.

Embedded SIM

Pin Number ISO 7816 Signal Purpose
1 (Index) C5 GND Ground
2 C6 NC Reserved
3 C7 I/O Input or output for interface
4 C8 NC Reserved
5 C4 NC Reserved
6 C3 CLK Clock signal input
7 C2 RST Reset signal input
8 C1 VCC Supply power input

Each contact point conforms to ISO 7816-3 specifications. Contact points C2, C4, and C8 are reserved and must remain isolated from other contact points (not physically or electrically connected).

For additional information, please contact us.